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The integration of active light-emitting elements into planar photonic circuits on a silicon nitride platform remains challenging due to material incompatibilities and high-temperature processing. Proposed hybrid method embeds monodisperse luminescent particles into lithographically defined wells above a 200 nm-thick silicon nitride taper coupler. A fabrication process involving wells etching, particle deposition, and planarization enables precise integration while maintaining waveguide integrity. When pumped at 950 nm the particles emit across 1500--1600 nm, peaking at 1532 nm (FWHM 60 nm), covering the optical telecommunication C-band. Numerical simulations yield an average coupling efficiency of 0.25% into the fundamental waveguide mode, suggesting significant potential for further device optimization. The approach provides a scalable route for integrating broadband telecommunications emitters on a silicon nitride platform.