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We investigate the influence of AlN buffer thickness on the structural, electrical, and thermal properties of AlGaN/GaN high-electron mobility transistors (HEMTs) grown on semi-insulating SiC substrates by metal-organic chemical vapor deposition. X-ray diffraction and atomic force microscopy reveal that while thin AlN layers (120 nm) exhibit compressive strain and smooth step-flow surfaces, thicker single-layer buffers (550 nm) develop tensile strain and increased surface roughness. Multi-layer buffer structures up to 2 {\mu}m alleviate strain and maintain surface integrity. Low-temperature Hall measurements confirm that electron mobility decreases with increasing interface roughness, with the highest mobility observed in the structure with a thin AlN buffer. Transient thermoreflectance measurements show that thermal conductivity (ThC) of the AlN buffer increases with the thickness, reaching 188 W/m.K at 300 K for the 2 {\mu}m buffer layer, which is approximately 60% of the bulk AlN ThC value. These results highlight the importance of optimizing AlN buffer design to balance strain relaxation, thermal management, and carrier transport for high-performance GaN-based HEMTs.