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Recent advances in silicon nitride nanomechanical resonators have pushed mechanical quality factors to ultra-high values by combining stress-induced dissipation dilution with mode-shape engineering. Neither mechanism alters the intrinsic quality factor $Q_{\mathrm{intr}}$. Targeting the intrinsic loss itself therefore remains an untapped route to even higher $Q$. Doing so first requires reliable quantification of $Q_{\mathrm{intr}}$, which has proven challenging. Here we present a robust methodology that quantifies $Q_{\mathrm{intr}}$ by combining automated mode identification with systematic ringdown measurements over a large number of mechanical modes. Applied to high-stress silicon nitride membranes, it reveals a systematic dependence of $Q_{\mathrm{intr}}$ on thickness that cannot be described using established models, particularly in the ultra-thin limit. We account for this trend with a phenomenological model that incorporates a thickness-dependent loss channel. Together, our method and model open a route toward a microscopic understanding of intrinsic dissipation and toward directly mitigating its loss channels.