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Embedded microfluidic cooling is a promising technology for dissipating the intense heat generated by high-performance electronic chips. However, the design and optimization of such coolers impose prohibitive computational costs when using conventional numerical solvers. Here, we present a parameterized physics-informed neural network (PINN) as a deep learning framework for rapidly and accurately predicting the thermohydraulic performance of embedded manifold microchannels. By incorporating four geometric dimensions along with three spatial coordinates as the network inputs, the proposed model enables multiphysics prediction across a continuous design space. Remarkably, our predicted velocity and temperature fields differ from finite-element simulations by relative errors of only 8.1% and 5.6%, respectively, while reducing the computational time and cost by over four orders of magnitude. Key to this framework is a composite strategy combining geometric ansatz embedding, the SOAP optimizer, and a thermal-conductivity-based curriculum learning scheme, which helps overcome the convergence challenges inherent in training PINNs for complex three-dimensional flows. Notably, by leveraging a highly optimized JAX backend, the network achieves convergence on a single consumer-grade GPU in less than four hours. Our approach offers a physics-consistent, real-time surrogate model that can substantially accelerate innovations in advanced microfluidic cooling of future electronics.